Thermalright TF9 2.9g High-Performance Thermal Paste | 9W/m·K | Easy Application | CPU & GPU Cooling Compound
Thermalright TF9 2.9g delivers exceptional cooling efficiency with a thermal conductivity of 9W/m·K. Designed for both CPU and GPU applications, it ensures lower temperatures and stable performance.
- High Thermal Conductivity: 9W/m·K
- Non-Corrosive & Non-Conductive
- Easy to Apply & Clean
- Perfect for High-Performance Builds
₨ 1,950 ₨ 21,000
Thermalright TF9 2.9g Thermal Paste is engineered to provide superior heat transfer between your CPU/GPU and the heatsink. With an impressive thermal conductivity of 9W/m·K, it ensures that heat is efficiently dissipated, resulting in lower operating temperatures and improved performance.
Whether you are building a gaming PC, overclocking your CPU, or assembling a workstation, the TF9 thermal paste offers reliability, consistency, and long-term stability. Its non-electrically conductive and non-corrosive formula ensures safe application across all components.
Key Features:
- Thermal Conductivity: 9W/m·K
- Capacity: 2.9 grams
- Easy Application Syringe Packaging
- Safe for CPUs, GPUs, and Consoles
- Non-Curing Formula for Long-Lasting Performance
Ideal For:
- PC Enthusiasts & Gamers
- System Builders
- Overclockers
Package Includes: 1 x Thermalright TF9 2.9g Thermal Paste with applicator.
| Specification | Details |
|---|---|
| Brand | Thermalright |
| Model | TF9 2.9G |
| Type | Thermal Paste / Thermal Compound |
| Thermal Conductivity | 9 W/m·K |
| Thermal Impedance | <0.01 ℃·cm²/W |
| Weight / Volume | 2.9 Grams |
| Color | Gray |
| Material Type | Silicone-based with metal oxide compounds |
| Electrical Conductivity | Non-Conductive |
| Viscosity | 2000 Pa·s |
| Operating Temperature | -50°C to +240°C |
| Storage Temperature | -40°C to +90°C |
| Durability | Long-lasting, non-drying |
| Application | CPU / GPU / Chipset / Heatsink |
| Package Includes | 1 x 2.9g Syringe + Applicator Tool |
Brand
Thermalright
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